We are a high-tech enterprise that integrates product development, production, and sales of PCB&FPC flexible circuit boards, and is gradually growing and expanding.
| Process project | Processing capability | Describe |
| Highest layer | 64 floors | PCB processing capability of 64 layers |
| Line width line | ≥3/3Mil | 3/3mil (finished copper thickness 0.5OZ) 4/4mil (finished copper thickness 1OZ), 5/5mil (copper thickness 2OZ), it is recommended to increase the line width and spacing |
| Minimum aperture | ≥0.2mm | Minimum hole diameter for mechanical drilling: 0.2mm, if conditions permit, it is recommended to design it to 0.3mm or above. Laser aperture: 0.1mm |
| Hole tolerance | ±0.07mm | The tolerance for mechanical drilling is ± 0.07mm |
| BGA solder pads | ≥8mil | Minimum BGA pad ≥ 8mil, minimum BGA pitch ≥ 0.4mm |
| Stamp hole diameter | 0.5mm | Stamp hole spacing ≥ 0.25mm, minimum number of hole arrangement for stamps must be ≥ 3 |
| Plug hole diameter | ≤0.6mm | Through holes larger than 0.6mm, surface solder pads covered with oil |
| Laser hole | 0.1mm±10% | Laser aperture: 0.1mm, aperture tolerance is ± 0.01mm |
| Through-hole welding ring | ≥4mil | Via ≥ 4mil, device hole ≥ 6mil, increasing the via solder ring is helpful for overcurrent |
| Effective Line Bridge | ≥4mil | It refers to the line width of the connection between two copper sheets in the circuit |
| Outer copper thickness | 35—140um | Refers to the thickness of the copper foil on the outer layer of the finished circuit board |
| Inner copper thickness | 17—35um | It refers to the line width of the connection between two copper sheets in the circuit |
| Solder mask type | Photosensitive ink | White, black (glossy, matte), blue, green, yellow, red, etc |
| Minimum character width | ≥0.6mm | The minimum width of characters is 0.6mm, and if it is less than 0.6mm, the physical board may have unclear characters |
| Character aspect ratio | ≥0.8mm | The minimum height of the characters is 0.8mm, and if it is less than 0.8mm, the physical board may have unclear characters |
| Character aspect ratio | 1:06 | The most suitable aspect ratio is more conducive to production |
| Surface Treatment | Tin spraying, lead-free tin spraying | Tin deposition, gold deposition, silver deposition, OSP, gold finger, selective gold deposition, electroplating gold deposition |
| Plate thickness range | 0.1—9mm | Conventional plate thickness: 0.254/0.4/0.6/0.8/1.0/1.2/1.6/2.0, with a maximum thickness of 9MM |
| Plate thickness tolerance | ± 10% | Thickness tolerance of circuit board |
| Minimum slot knife | 0.60mm | The minimum width of copper groove inside the board is 0.60mm, and there is no copper groove of 0.6mm |
| Exterior spacing | ≥0.25mm（10mil） | When shipping the gong board, the distance between the routing of the circuit layer and the outer contour of the board must be greater than 0.25mm; V-cut splicing board shipment, the distance between the wiring and the V-cut centerline must not be less than 0.4mm |
| Half hole process | ≥0.5mm | Half hole process is a special process, and the minimum aperture must not be less than 0.5mm |
| Splicing without gaps | 0mm gap splicing | It is a laminated shipment, with a gap of 0 between the middle board and the board |
| Impedance tolerance | ≥1.6mm | The gap between the spliced boards with gaps should not be less than 1.6mm, otherwise it will be difficult to edge the gong |
| Impedance tolerance | 土10% | Single ended or coplanar single ended impedance controllable: 45~85 ohms, differential or coplanar differential impedance controllable: 85~110 ohms |
| Solder bridge | ≥4mil | Green oil bridge: 0.1mm, variegated oil: 0.12mm, black and white oil: 0.15mm |
| Pads Copper laying method | Hatch method for laying copper | The manufacturer uses reduced copper plating, and customers who use pads for this design must pay attention to it |
| Pads Drawing slots in software | Using Drill Drawing Layer | If there are many non-metallic grooves on the board, please draw them on the Drill Drawing layer |
| Protel/dxp Software window layer | Solder layer | A few engineers mistakenly placed it on the paste layer, and the PCB did not process the paste layer |
| Protel/dxp Exterior layer | Use Keepout layer or mechanical layer | Please note: Only one outer layer is allowed to exist in a file, and two outer layers must not exist at the same time. Please delete unused outer layers, that is, when drawing an outer layer, only one of Keepout layer or mechanical layer can be selected |
| Special process | Resin plug hole, disc hole, mixed pressure plate, PTFE, blind buried hole, binding IC (special process requires process review) | |
| Board type | 罗杰斯/Rogers,泰康/TACONIC | Yalong/ARLON, Wangling/F4B, Isola/Isola, Taixing high-frequency board, TP-2, FR-4/A-level board materials |
| peel strength | ≥2.0N/cm | ≥2.0N/cm |
| Flame retardancy | 94V-0 | 94V-0 |
