Shenzhen Jieshengxin Electronics Co., Ltd
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Engaged in the research and development, design, production, and sales of high-frequency boards,
FPC soft hard combination boards, HDI blind hole boards, through-hole boards+PCBA technology

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About Us

About Us

Shenzhen Jieshengxin Electronics Co., Ltd. is a high-tech enterprise specializing in the research and development, design, production, and sales of high-precision double-sided and multi-layer rigid circuit boards (PCBs) (1-32 layers), flexible printed circuit boards (FPCs) and soft hard combination circuit boards (1-12 layers), as well as high-frequency microwave RF hybrid pressure induction printing technology. The company was founded in 2005 and is a PCB&FPC flexible circuit board enterprise that integrates product development, production, and sales, gradually growing and expanding.
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The production process and sampling difficulties of multi-layer circuit boards

The production process and sampling difficulties of multi-layer circuit boards

The reduction method mostly uses chemical corrosion, which is economical and efficient. Just chemical corrosion attacks indiscriminately, so it is necessary to protect the required conductive pattern by coating a layer of corrosion inhibitor on the conductive pattern
Quick prototyping of PCB circuit boards (why do we charge expedited fees)

Quick prototyping of PCB circuit boards (why do we charge expedited fees)

PCB rapid prototyping, as the name suggests, is to quickly produce PCB samples within the time required by the customer. The customer only needs to send the prototyping materials to the PCB manufacturer
What are the commonly used parameters for quality assessment of PCB multi-layer circuit boards

What are the commonly used parameters for quality assessment of PCB multi-layer circuit boards

The commonly used parameters for evaluating the quality of PCB boards include glass transition temperature (Tg value), coefficient of thermal expansion (CTE), PCB decomposition temperature (Td), heat resistance, electrical performance, and PCB water absorption rate. Now, let us explain the glass transition temperature in detail for you
What are the commonly used laminated structures for HDI multilayer boards

What are the commonly used laminated structures for HDI multilayer boards

The stacked structure is an important factor affecting the EMC performance of PCB boards and an important means of suppressing electromagnetic interference. With the continuous emergence of high-speed circuits
Introduction to the process characteristics and process flow of selective soldering of PCB circuit boards

Introduction to the process characteristics and process flow of selective soldering of PCB circuit boards

A clear trend in the development of circuit boards is reflow soldering technology. Basically, traditional plug-in components can also use reflow soldering technology, which is commonly known as through-hole reflow soldering

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