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Release date:2024-10-10
PCB wiring is to lay out printed wires according to the PCB circuit schematic, wire table, and the required wire width and spacing. So, what knowledge should be mastered for PCB multi-layer circuit board wiring?
1. On the premise of meeting the requirements, wiring should be as simple as possible. The order of selecting wiring methods is single-layer double-layer multi-layer.
2. A grounding wire shield should be installed next to the input line of the analog circuit; The layout of wires on the same layer should be evenly distributed; The conductive area of each layer should be relatively balanced.
3. Signal lines should change direction with diagonal lines or smooth transitions to avoid electric field concentration, signal reflection, and the generation of additional impedance.
4. Digital circuits and analog circuits should be separated in wiring to avoid mutual interference; Grounding wires should be placed between signal lines of different frequencies to prevent crosstalk. For the convenience of testing, necessary breakpoints and testing points should be set in the design.
5. When grounding and connecting power to circuit components, the wiring should be as short and close as possible to reduce internal resistance.
6. The routing of the upper and lower layers should be perpendicular to each other to reduce coupling, and alignment or parallelism of the routing of the upper and lower layers should be avoided.
7. The length of multiple I/O lines in high-speed circuits, as well as I/O lines in differential amplifiers, balanced amplifiers, and other circuits, should be equal to avoid unnecessary delays or phase shifts.
8. When connecting PCB pads to larger conductive areas, thin wires with a length of not less than 0.5m and a width of not less than 0.13mm should be used for thermal isolation.
9. The wire closest to the edge of SMB should be at least 5mm away from the edge of SMB, and the grounding wire can be placed close to the edge of SMB if necessary.
10. The common power and grounding wires on double-sided SMB should be arranged as close to the edge of SMB as possible and distributed on both sides of SMB. Multi layer SMB can be equipped with power and ground layers in the inner layer, which are connected to the power and ground wires of each layer through metalized holes. The large area of wires, power and ground wires in the inner layer should be designed as a mesh.
