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Release date:2024-10-10
The production process of soft hard integrated circuit boards is as follows:
01 Design board acceptance
The factory engineering department accepts and inspects the design board files sent by the customer.
The inspection includes: whether the design file is appropriate, whether the layers are missing, ensuring that the file has borders, whether the drilling file exists, etc.
If there are design defects, the engineering department will notify the designer to make modifications. If there are no design issues, mass production can be carried out according to the design.
02 Print the design as transparent film
Print checked design files on transparent film.
Project light onto these thin films to expose the photoresist on the circuit board in a manner similar to an exposure photograph. This circuit board design is like a movie, vivid and particularly lively.
03 Cutting and edging of fiberglass
Select fiberglass and cut and polish it.
Select FR-4 glass fiber with copper plating on the top and bottom layers, and then cut the design dimensions on a cutting machine. Due to the rough edges of the fiberglass, we need to polish its edges.
04 Inner layer production
The top and bottom layers of fiberglass are covered with plastic dry film and hardened under ultraviolet irradiation.
After the glass fiber is hardened with dry film on both sides, it can be pressed together by machine to effectively prevent copper from being dissolved by alkaline liquids in subsequent processes.
05 Etching process
The purpose of the entire etching process is to remove excess copper and photoresist from the copper plate, and to complete the prototype of the PCB board through a series of processes.
Remove excess copper and photoresist from the laminated glass fibers, immerse them in alkaline solution to complete the etching process, and finally complete the entire etching process through a combination of peeling, water washing, drying, and plate drying.
06 Automatic Optical Inspection (AOI) and Vacuum Clamp (PP)
The purpose of automatic optical inspection is to check the etching condition of the inner layer and ensure that the etching of the inner layer is completely correct.
